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    Shenyang instrument institute "high performance high temperature pressure sensor technology research
    2016-03-02 10:12

    in May 2013, the state ministry of science and technical development of the scientific research institutes in 2013 research has issued a special fund budget, shenyang instrument research institute co., LTD., subordinate unit & other; High performance high temperature pressure sensor technology research & throughout; , & other Semiconductor bare core particle detection sorting equipment throughout the development &; , & other Semiconductor bare core particle detection sorting equipment throughout the development &; , & other 3 d digital camera detection technology research and development of the testing equipment & throughout; .

    National ministry of science and technology technical development of the scientific research institutes in 2013 research has issued a special fund budget, shenyang instrument research institute co., LTD. (three) contains a court declare a total of four items, all approved, total approved the funding of 4.54 million yuan, the money has be given to the enterprises in full during the month.

    Shall be borne by the force sensor center UK Watson & other High performance high temperature pressure sensor technology research & throughout; Project approved the funding of 1.23 million yuan. The project in accordance with the need of sensor of high temperature range of wide application, on the high temperature sensitive silicon chip design, manufacturing process and the high temperature pressure sensor application technology research, aims to improve the performance of high temperature pressure sensor, the stability, reliability, industrialization, large-scale technical basis for the product.

    Shall be borne by the qinhuangdao audio-visual machinery research institute and other; Semiconductor bare core particle detection sorting equipment throughout the development &; Project approved the funding of 1.13 million yuan. The project in view of the glass passivation process (GPP) production of semiconductor chips bare core grain, develop a new quality detection and sorting equipment, project revolves around precision high-speed test structure, precision points warehouse technology study, the key techniques such as solving the problem of classification of different technical parameters of products.
    Shall be borne by the hangzhou photographic machinery research institute and other; 3 d digital camera detection technology research and development of the testing equipment & throughout; Project approved the funding of 900000 yuan. The project intends to establish a evaluation of 3 d digital image quality evaluation system, to determine the 3 d digital image quality evaluation of technical indicators and the corresponding test method, industry standards, at the same time, form a complete set of automated testing software development performance test and 3 d imaging device.


    Held by shenyang institute of vacuum technology & other; VADP type vacuum induction furnace melting equipment research and development & throughout; Project approved the funding of 1.28 million yuan. The project plans through a 6 tons VADP type induction furnace induction melting equipment research and development, breakthrough VADP type vacuum induction furnace melting equipment design of the core technology, for the subsequent 1-12 tonnes VADP type vacuum induction furnace series designed to provide technical support.

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