1, MEMS process and manufacturing technics of a new generation of solid state sensor microstructure: deep reactive ion etching (DRIE) process or IGP process; Encapsulation process, such as room temperature bonding inversion welding, stress free low encapsulation structure and chip assembly process;

2, integration process and multivariate composite sensor microstructure integrated manufacturing process; Industrial control with multivariate composite sensor;

3, intelligent cable or wireless technology and intelligent sensor signal detection, transformation processing, logic and function calculation, two-way communication, intelligent technology such as self-diagnosis; ZhiNengDuo variable sensor, intelligent power sensor and all kinds of intelligent sensor, transducer;
4, network technology and networked sensor, the sensor with functions of industrial standard interfaces and protocols.


At the same time, by 2020, sensor and meter Watson Wchangeorganisation table element field should strive to achieve the three strategic objectives:
With industrial control, automotive, communications, environmental protection for key services, with sensors, elastic components, optical components, dedicated circuit as the key object, development with independent intellectual property rights of the original technology and products;

Based on MEMS technology, based on integration, intelligence and network technology, strengthen the manufacturing process and the development of new sensors and instrumentation components, to leading products and close to the advanced level of similar foreign products; To increase the variety, improve quality and economic benefit as the main target, accelerate the industrialization, the varieties of domestic sensors and instrumentation components share reached 70% & other; More than 80% 80%, the high grade product.