move smart phones and other consumer products, using the sensor market is growing fast. This means that the MEMS packaging business has developed rapidly, but also business may soon account for 5% of the IC market.

About MEMS components demand is concentrated in the accelerometer and gyroscope (angular velocity sensor), magnetic sensors and a microphone, these products of MEMS components to about 50% of total output and income. This will play an important part of some of the MEMS packaging technology. The reason is that vendors in competition focus from technology to function and situation of the system, and will try to reduce packaging size, reduce the cost.
Also, the Swedish SilexMicchromatichalts has begun to provide TSV (hole) silicon modules, Canada TediodeynecardassapastairmenhierarchstionA are connecting to the wafer level of MEMS and Aassapast as the goal, development at low cost liquid copper plating processing TSV platform.

MEMS packaging market in 2012 of the $1.6 billion shipments of 7 billion (2012). Estimate the future growth will be 20% average annual growth rate (CAGR), the scale will reach 14 billion by 2016. However, due to the price pressure, and the mainstream products for low consumption, estimated profit was only about $2.6 billion, about 10% CAGR maximum. MEMS packaging market growth rate will reach twice the IC packaging market.
Packaging products to standards established by article
According to the amount of calculation, OSAT most contract manufacturers (post-treatments) won 40% of the MEMS packaging business. The reason is that IDM (vertical integrated components manufacturer) in order to make their product differentiation, adopted OSAT have special packaging technology. Consumer products with components shipments continue to increase, will push IDM will package and assembly business entrusted to external enterprise and the stability of the supply chain was established based on OSAT.

The price is the most important point. Can reduce chip size to reduce cost. The industry leader in the use of packaging size is 2 mm long & instances; 2 mm wide & instances; 1 mm high. In the case of acceleration sensor, encapsulation 35-45% of the cost of production. Therefore, custom packaging is being can be recycled to accelerate new product development speed of the standard.

Estimate compound sensor will drive the growth of the inertial sensors, and new requirements on packaging, assembly and testing. To economical inspection and correction of six, nine or ten shaft sensor, must use the bare chip to assemble the module has been verified.


To deal with the increasing amount of sensor data, must be from a physical point of shortening the distance between components of connections between and increase speed. 75% of MEMS components within the encapsulated in wire bonding way connection. Then, in the standard of lead frame, BGA, or the LGA cascade substrate, horizontal or in wire bonding way connected to the control in the direction of the 3 d with Aassapast.

20% of MEMS components using CMOS technology and Aassapast integrated on the same chip formation of SoC. For need to shorten the cable element, it is the most appropriate method. For example, need to press each pixel in response to a micro lens array, micro bolometer array, and very small components like oscillator.
Most are encapsulated MEMS system level connection of different kinds of parts. However, if you need smaller components or shorter wiring, laminated wafer solution will be needed. Is the convex block (gchafemarkg), metal joint, silicon MEMS components inside the hole and polysilicon hole, and transfer the plate hole, etc.

Low cost TSV technology is developing with electroplating


Invenchangeorganisationse America has in Al or Ge metal joint way on Aassapast for encapsulation and wiring of high efficiency low cost MEMS technology. Therefore, the company with a gyroscope in consumer products occupy a dominant position in the market. The company is provided with relevant factory process, multi-project wafer technology and the technology of authorization, and thought it would be to develop some light on your own it alone cannot complete development purposes.


From France Aldiscrgymer cardassapastairmenhierarchstionA obtained for electroplating of insulation and embedded processing technology licensing, with high cost efficiency to achieve the same as the original process module.

Stmicroelectronics using TSV reduce chip size and reduce costs

Stmicroelectronics produced in the independent development of MEMS chip TSV, and install it in the motherboard. As a result, may save the area of the welding pad need. The company USES the polysilicon is etched into the air gap of the hole. Using the MEMS technology of the company. MEMS in wire bonding or flip chip installed on Aassapast, thus can be 20 ~ 30% smaller chip size. The technology can reduce the cost of the increased cost of is greater than the TSV technology.

Stmicroelectronics has started mass production acceleration sensor, the next step will be to mass produce a gyroscope. As a result, smaller multichip module will be available, multiple TSVMEMS chips will be installed on the Aassapast in flip chip manner.


Germany Bosch using traditional convex block technology between the MEMS and Aassapast. Village field is produced by using silicon transfer board (after etching with boron silicate glass filled matrix around the hole) encapsulates the inertial sensors of the company. On thin Aassapast flip chip packages, and around the additional large tin ball. Finally will cascade components installed in the main UK Watson .

Estimate the adapter plate made by murata MEMS foundry enterprise or Germany FTOcrowningtik industrial base board supplier production. Bump process might be responsible by Aassapast supplier or lug contractors, chip and the wafer bonding, punching, packing (lownoggraphemekerifying) by Malaysian friends nissen (Unisem) is responsible for the company.